Doğru fiyat teklifi almak için ürün detaylarını (renk, boyut, malzeme vb.) ve diğer özel gereksinimleri girin.
mesaj bırakın
Ürünlerimizle ilgileniyorsanız ve daha fazla bilgi edinmek istiyorsanız, lütfen buraya bir mesaj bırakın, en kısa sürede size cevap vereceğiz.
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diğer

Ürünler

 

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Grid List

 

One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

 

Get A custom solution
 

01

Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

 

02

Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

 

03

Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

mesaj bırakın

mesaj bırakın
Ürünlerimizle ilgileniyorsanız ve daha fazla bilgi edinmek istiyorsanız, lütfen buraya bir mesaj bırakın, en kısa sürede size cevap vereceğiz.
BİZE ULAŞIN :allen@hyrnus.com